Silicon Analysts
Connects Claude to live semiconductor cost data from siliconanalysts.com via their public API. Exposes chip manufacturing economics, HBM pricing, wafer costs across nodes from 180nm to 2nm, and BOM breakdowns for 13 AI accelerators including B200 and H100. Four JSON endpoints cover accelerator specs, HBM market data, fab details, and 30+ analysis articles. Reach for this when modeling chip economics, comparing foundry options, or answering questions about GPU manufacturing costs with current data instead of stale training cutoffs. No API key required. The MCP layer turns their cost calculators and market intelligence into structured queries Claude can run mid-conversation.
- tools
- 23
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- Secret needed
- transport
- HTTP
- last updated
- Aug 30, 2026
Install
From registry metadata$ npx add-mcp https://siliconanalysts.com/api/mcp --name silicon-analysts --header 'Authorization: Bearer ${API_TOKEN}'Run in your terminal. add-mcp asks which agents to add it to, then asks for each value it needs. Add -g to install it for every project.
Review the command, arguments and environment values before installing. MCP servers run with your local permissions.
Other ways
Claude Code
$ claude mcp add --transport http silicon-analysts https://siliconanalysts.com/api/mcp --header 'Authorization: YOUR_AUTHORIZATION'Run in your terminal. Add --scope user to make it available in every project.
Tools
Verified live · 23 toolsVerified live against the running server on Nov 6, 2026.
get_accelerator_costsReturns 18 AI accelerators (H100/H200/B100/B200/GB200/GB300/Rubin, MI300X/MI355X/MI455X, Gaudi 3, TPU v5p/v6e, Trainium 2/3, Maia 100, MTIA v2) with structured fields: chip, vendor, processNode, dieSizeMm2, memoryType, memoryCapacityGb, memoryBandwidthTbS, fp8TflopsSparse, bf1...3 params
Returns 18 AI accelerators (H100/H200/B100/B200/GB200/GB300/Rubin, MI300X/MI355X/MI455X, Gaudi 3, TPU v5p/v6e, Trainium 2/3, Maia 100, MTIA v2) with structured fields: chip, vendor, processNode, dieSizeMm2, memoryType, memoryCapacityGb, memoryBandwidthTbS, fp8TflopsSparse, bf1...
chipstringfieldsstringvendorstringnvidia · amd · google · intel · aws · metacalculate_chip_costPure-function chip cost estimator. Given die dimensions (mm), process node, and optional packaging/HBM parameters, returns: estimatedChipCost (USD), dieArea (mm²), grossDiesPerWafer, frontendYield (%), totalYield (%), and a costBreakdown {waferCostPerGoodDie, packagingAndTestC...18 params
Pure-function chip cost estimator. Given die dimensions (mm), process node, and optional packaging/HBM parameters, returns: estimatedChipCost (USD), dieArea (mm²), grossDiesPerWafer, frontendYield (%), totalYield (%), and a costBreakdown {waferCostPerGoodDie, packagingAndTestC...
backendYieldnumberdefectDensitynumberdieHeight*numberdieWidth*numberenergyFacilityOverheadbooleanenergyRegionstringtexas · ohio · arizona · china · korea · taiwanhbmCostnumberhbmStacksnumberkgdTestCoveragenumbermarginTargetnumberpackagingCostnumberpackagingTypestringprocessNodestringsubstratestringwafer-300mm · panel-310x310testCostnumbervolumenumberwaferCostnumberyieldModelstringestimate_lead_timeHeuristic chip manufacturing LEAD TIME estimator (MANUFACTURING CYCLE TIME). Given total mask layers (or a processNode to default them), foundry utilization % (optional — defaults from live foundry-allocation data), and packagingType, returns min/max bands: fabDays, fabWeeks,...4 params
Heuristic chip manufacturing LEAD TIME estimator (MANUFACTURING CYCLE TIME). Given total mask layers (or a processNode to default them), foundry utilization % (optional — defaults from live foundry-allocation data), and packagingType, returns min/max bands: fabDays, fabWeeks,...
maskLayersintegerpackagingTypestringconventional · flip-chip · cowos · wirebond-bga · qfp · fc-bgaprocessNodestringutilizationnumberget_hbm_market_dataReturns 10 HBM market sub-tables: accelerators, specs, marketShare, spotPrices (RETIRED 2026-07-28 — frozen), leadingIndicators, qualificationFeed, revenueForecast, supplierRevenue, validationChecks, bitDemand. Optional `table` parameter narrows to a single sub-table; omitting...1 params
Returns 10 HBM market sub-tables: accelerators, specs, marketShare, spotPrices (RETIRED 2026-07-28 — frozen), leadingIndicators, qualificationFeed, revenueForecast, supplierRevenue, validationChecks, bitDemand. Optional `table` parameter narrows to a single sub-table; omitting...
tablestringaccelerators · specs · marketShare · spotPrices · leadingIndicators · qualificationFeedget_market_pulseReturns curated supply-chain headlines with trend direction (up/down/neutral), source attribution, and impact analysis. Categories: logic, memory, packaging, connectivity, power, geopolitics. Defaults to all categories, all trends, no limit. USE THIS for: "what's happening in...3 params
Returns curated supply-chain headlines with trend direction (up/down/neutral), source attribution, and impact analysis. Categories: logic, memory, packaging, connectivity, power, geopolitics. Defaults to all categories, all trends, no limit. USE THIS for: "what's happening in...
categorystringlogic · memory · packaging · connectivity · power · geopoliticslimitintegertrendstringup · down · neutralget_wafer_pricingReturns 300mm wafer price ranges (min/avg/max USD), defect density, NRE/mask-set cost, and node maturity for: tsmc-n3, tsmc-n5, tsmc-n7, tsmc-n16, tsmc-28, samsung-3nm, samsung-5nm, samsung-7nm, samsung-14nm, intel-7, intel-16, gf-12lp, gf-fdx, umc-22-28, umc-40, smic-28. Opti...1 params
Returns 300mm wafer price ranges (min/avg/max USD), defect density, NRE/mask-set cost, and node maturity for: tsmc-n3, tsmc-n5, tsmc-n7, tsmc-n16, tsmc-28, samsung-3nm, samsung-5nm, samsung-7nm, samsung-14nm, intel-7, intel-16, gf-12lp, gf-fdx, umc-22-28, umc-40, smic-28. Opti...
nodestringget_packaging_costsReturns two sub-arrays: `packaging` (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and `hbmSpecs` (HBM2 through HBM4 cost per stack + bandwidth/capacity). Optional `type` filter narrows packaging array to one technology....1 params
Returns two sub-arrays: `packaging` (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and `hbmSpecs` (HBM2 through HBM4 cost per stack + bandwidth/capacity). Optional `type` filter narrows packaging array to one technology....
typestringget_hbm_qualificationSourced HBM qualification tracker: which memory vendor (SK Hynix, Samsung, Micron) passed which AI-accelerator customer's qualification (NVIDIA Vera Rubin/GB300/B300/H200, AMD MI350/MI325X, Broadcom), by generation (HBM3/HBM3E/HBM4) and stack height. Returns `matrix` (current...4 params
Sourced HBM qualification tracker: which memory vendor (SK Hynix, Samsung, Micron) passed which AI-accelerator customer's qualification (NVIDIA Vera Rubin/GB300/B300/H200, AMD MI350/MI325X, Broadcom), by generation (HBM3/HBM3E/HBM4) and stack height. Returns `matrix` (current...
customerstringgenerationstringHBM3 · HBM3E · HBM4include_timelinesbooleanvendorstringSK Hynix · Samsung · Micronget_foundry_allocationFoundry & advanced-packaging ALLOCATION — the current-state snapshot per node/tech (TSMC/Samsung/Intel/... × N2/N3/CoWoS-L/SoIC/...) plus optional time-series HISTORY. Current fields: allocation_status (fully_booked → available), lead_time_weeks_min/max + trend, utilization, p...7 params
Foundry & advanced-packaging ALLOCATION — the current-state snapshot per node/tech (TSMC/Samsung/Intel/... × N2/N3/CoWoS-L/SoIC/...) plus optional time-series HISTORY. Current fields: allocation_status (fully_booked → available), lead_time_weeks_min/max + trend, utilization, p...
categorystringleading_edge · advanced · mature · packaging · hbmcustomerstringfoundrystringhistory_metricstringlead_time · pct_locked · customer_allocation · cowos_capacity · foundry_utilizationinclude_historybooleanlimitintegernodestringget_foundry_economicsFoundry IR ECONOMICS — per-foundry, per-process-node, per-fiscal-quarter wafer ASP (min/max/blended, USD per 300mm-equivalent wafer, $250-grained) and fab UTILIZATION (%), derived exclusively from PUBLIC IR materials (earnings releases/transcripts/decks, trade press) via a doc...8 params
Foundry IR ECONOMICS — per-foundry, per-process-node, per-fiscal-quarter wafer ASP (min/max/blended, USD per 300mm-equivalent wafer, $250-grained) and fab UTILIZATION (%), derived exclusively from PUBLIC IR materials (earnings releases/transcripts/decks, trade press) via a doc...
foundrystringtsmc · umc · intel · samsung · smic · gffromstringinclude_factsbooleanlimitintegernodestringnode_groupstringleading_2nm · leading_3nm · class_5nm · class_7nm · class_10_22nm · mature_28nm_plusquarterstringtostringget_recent_changes"What Changed" — recent MOVEMENTS in Silicon Analysts' public data over a 7d/30d window, derived from the daily snapshot ledger. Each moved metric returns direction (up/down), magnitude (pct_delta for value metrics, pp_delta for percentage metrics), old/new values, the two sna...5 params
"What Changed" — recent MOVEMENTS in Silicon Analysts' public data over a 7d/30d window, derived from the daily snapshot ledger. Each moved metric returns direction (up/down), magnitude (pct_delta for value metrics, pp_delta for percentage metrics), old/new values, the two sna...
datasetIdstringlimitintegerminDeltanumbersincestringwindowstring7d · 30ddefault: 7dget_market_datasetCurated market-data TIME SERIES with per-point sourcing — the datasets behind siliconanalysts.com/market-data. Includes: hbm-pricing (HBM contract + blended $/GB by generation, HBM2→HBM4, anchors 2017→2026 — series_keys like 'hbm3e-contract'; NOTE: no public HBM spot market ex...2 params
Curated market-data TIME SERIES with per-point sourcing — the datasets behind siliconanalysts.com/market-data. Includes: hbm-pricing (HBM contract + blended $/GB by generation, HBM2→HBM4, anchors 2017→2026 — series_keys like 'hbm3e-contract'; NOTE: no public HBM spot market ex...
dataset*stringseries_keystringget_market_intelligenceMarket Intelligence — the freshest SOURCED semiconductor market briefs, generated daily from a Tavily + Claude scan of primary press, earnings, and trade outlets. Each brief returns title, severity (Critical/High/Medium/Low), confidence_score (0-100), quantitative_impact (e.g....5 params
Market Intelligence — the freshest SOURCED semiconductor market briefs, generated daily from a Tavily + Claude scan of primary press, earnings, and trade outlets. Each brief returns title, severity (Critical/High/Medium/Low), confidence_score (0-100), quantitative_impact (e.g....
categorystringlimitintegerpublishedOnlybooleanseveritystringCritical · High · Medium · Lowsincestringget_benchmark_historyHistorical Benchmarks — the bitemporal benchmark-observations ledger behind the Chip Cost Calculator: wafer cost by node/foundry (deflationary curves), defect-density (D0) learning curves per node, advanced-packaging costs incl. the broken-out CoWoS interposer entity, test cos...7 params
Historical Benchmarks — the bitemporal benchmark-observations ledger behind the Chip Cost Calculator: wafer cost by node/foundry (deflationary curves), defect-density (D0) learning curves per node, advanced-packaging costs incl. the broken-out CoWoS interposer entity, test cos...
benchmark_type*stringwafer_cost · defect_density · packaging_cost · interposer_cost · test_cost · backend_yieldentity_idstringfoundrystringfromstringgrainstringraw · month · quarterdefault: rawlimitintegertostringget_fab_capacityFab Capacity — Silicon Analysts' per-fab, per-tech-node-class capacity ESTIMATES from the fabs + fab_capacity_snapshots time-series (100+ fab and advanced-packaging sites: TSMC, Samsung, Intel, SMIC, GlobalFoundries, SK hynix, Micron and more; Frontend in kwspm, Backend advanc...7 params
Fab Capacity — Silicon Analysts' per-fab, per-tech-node-class capacity ESTIMATES from the fabs + fab_capacity_snapshots time-series (100+ fab and advanced-packaging sites: TSMC, Samsung, Intel, SMIC, GlobalFoundries, SK hynix, Micron and more; Frontend in kwspm, Backend advanc...
as_ofstringcountrystringfab_idstringfoundrystringlimitintegerseriesbooleantech_node_classstringget_forecastsForecast Vintages — third-party forecasts (research firms like TrendForce/WSTS/SEMI, and company capex/bit-growth guidance) archived with their ORIGINAL publication date. Query the REVISION HISTORY, not just the latest number: "what did TrendForce say about 2026 HBM bit growth...11 params
Forecast Vintages — third-party forecasts (research firms like TrendForce/WSTS/SEMI, and company capex/bit-growth guidance) archived with their ORIGINAL publication date. Query the REVISION HISTORY, not just the latest number: "what did TrendForce say about 2026 HBM bit growth...
allbooleanentity_idstringfromstringgroupstringnone · serieslimitintegermetricstringoriginatorstringoriginator_typestringresearch_firm · company_guidance · government · bank · industry_body · othersincestringtarget_periodstringtostringget_track_recordForecast Track Record — Silicon Analysts' OWN projections, frozen monthly into write-once vintages and graded against outcomes. Every row: model, scenario (bear/base/bull), series, target period, the predicted mid + low–high band frozen at vintage time, and once the period mat...3 params
Forecast Track Record — Silicon Analysts' OWN projections, frozen monthly into write-once vintages and graded against outcomes. Every row: model, scenario (bear/base/bull), series, target period, the predicted mid + low–high band frozen at vintage time, and once the period mat...
include_assumptionsbooleanmodelstringseriesstringget_bottlenecksAI Hardware Bottleneck Board — eight points where AI accelerator supply can stall (CoWoS-L packaging, HBM, TSMC N3, the HBM base die on foundry logic, large ABF substrates, T-glass, test equipment, InP lasers), each with a judged state: loose / balanced / tight / allocated / s...3 params
AI Hardware Bottleneck Board — eight points where AI accelerator supply can stall (CoWoS-L packaging, HBM, TSMC N3, the HBM base die on foundry logic, large ABF substrates, T-glass, test equipment, InP lasers), each with a judged state: loose / balanced / tight / allocated / s...
include_historybooleannodestringstatestringloose · balanced · tight · allocated · sold_out · watchget_wfe_signalsWFE Order-Book — wafer-fab-equipment maker disclosures (ASML, Applied Materials, Lam Research, KLA, Tokyo Electron) from quarterly IR: bookings, backlog, segment revenue, and guidance, in the STATED currency (EUR for ASML, JPY for TEL, USD for the rest — never converted). The...9 params
WFE Order-Book — wafer-fab-equipment maker disclosures (ASML, Applied Materials, Lam Research, KLA, Tokyo Electron) from quarterly IR: bookings, backlog, segment revenue, and guidance, in the STATED currency (EUR for ASML, JPY for TEL, USD for the rest — never converted). The...
allbooleancompanystringasml · amat · lam · kla · telfiscal_periodstringfromstringlimitintegermetricstringsegmentstringsincestringtostringget_fab_eventsFab Milestones — the dated construction & ramp event log: announcement → groundbreaking → equipment move-in → risk production → HVM, plus expansions and SCHEDULE SLIPS recorded as their own events (a delay never overwrites the original plan). Back to 2020. Each row: foundry, f...9 params
Fab Milestones — the dated construction & ramp event log: announcement → groundbreaking → equipment move-in → risk production → HVM, plus expansions and SCHEDULE SLIPS recorded as their own events (a delay never overwrites the original plan). Back to 2020. Each row: foundry, f...
allbooleancountrystringevent_typestringfab_idstringfoundrystringfromstringlimitintegersincestringtostringget_policy_eventsTrade-Policy Timeline — the dated log of semiconductor trade-policy actions (export controls, entity listings, license policies, tariffs, subsidies, retaliation) anchored to GOVERNMENT PRIMARY documents (Federal Register / BIS, USTR, MOFCOM, METI, EU, Netherlands…), back to th...8 params
Trade-Policy Timeline — the dated log of semiconductor trade-policy actions (export controls, entity listings, license policies, tariffs, subsidies, retaliation) anchored to GOVERNMENT PRIMARY documents (Federal Register / BIS, USTR, MOFCOM, METI, EU, Netherlands…), back to th...
agencystringallbooleanevent_typestringfromstringjurisdictionstringlimitintegersincestringtostringsearchSearch Silicon Analysts — returns up to 10 matching records as {results: [{id, title, url}]}: curated market datasets and their individual series (HBM contract $/GB by generation, DRAM/NAND pricing, TSMC wafer price history, CoWoS capacity and lead times, capex), the reference...1 params
Search Silicon Analysts — returns up to 10 matching records as {results: [{id, title, url}]}: curated market datasets and their individual series (HBM contract $/GB by generation, DRAM/NAND pricing, TSMC wafer price history, CoWoS capacity and lead times, capex), the reference...
query*stringfetchFetch one Silicon Analysts record by the id search returned — returns {id, title, text, url, metadata}. text is a compact, citable plain-text rendering of the record's CURRENT values (a dataset's points with value, range, data_type, confidence, source and date per point; a too...1 params
Fetch one Silicon Analysts record by the id search returned — returns {id, title, text, url, metadata}. text is a compact, citable plain-text rendering of the record's CURRENT values (a dataset's points with value, range, data_type, confidence, source and date per point; a too...
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Details
- Website
- siliconanalysts.com
- Category
- Data & Analytics
- Transport
- HTTP
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- Registry
- MCP registry, active
- Tools verified
- Nov 6, 2026